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Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.
Micron Technology, Inc. (NASDAQ: MU) broke ground on a new HBM advanced packaging facility in Singapore, expanding its capacity and creating jobs.
The Coalition for Epidemic Preparedness Innovations ( CEPI) is awarding $3.7 million in new funding to Micron Biomedical to advance research into an innovative technology that could overcome critical ...
Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.
Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...
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It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new ...
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Singapore can be expected to play a larger role in developing complex artificial intelligence (AI) applications when Micron's ...