The HFA80A automotive-grade analog-input class-D audio amplifier combines high efficiency, small size, and a low bill of materials, with load diagnostics optimized for automotive ... ST has introduced ...

Sondrel has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer. Ollie Jones ... Semiconductor ...

AspenCore China's China Fabless 100 ranks leading semiconductor firms, showcasing innovation in 10 technical segments. This year's report features public company rankings, market mapping, and key ...

Lawrence Livermore researchers developed a 3D-printable silicone foam with carbon nanotubes, delivering cushioning and ESD protection for electronics. This breakthrough could revolutionize robotics ...

Summary Dell Technologies reported mixed Q3 results, with earnings surpassing expectations but revenue missing forecasts. Despite strong AI-driven growth in server sales, shares dropped 10% after Q4 ...

MediaTek ramps up its challenge to Qualcomm in India's premium 5G market by partnering with Chinese smartphone makers for high-end models. The company strategically targets growth, aiming to expand ...

SIA Applauds Finalization of CHIPS Investments for Intel Manufacturing Projects: Summary The Semiconductor Industry Association (SIA) praised the finalization of CHIPS Act investm ...

Summary TSMC launched its first 2-nanometer fab in Kaohsiung six months ahead of schedule, signaling robust global demand for advanced chips. The facility, set for 2025 production, will drive AI and ...

Summary NoC soft tiling revolutionizes chip design by enabling scalable, modular systems-on-chip (SoC) through reusable, pre-verified tiles. Ideal for AI-intensive applications like ADAS and LLM ...

Summary TSMC Arizona is expanding its apprenticeship program, adding roles for equipment, process, and manufacturing technicians. By 2024, 130 apprentices will participate, supported by a $5 million ...

Beijing's trade negotiator engaged with Nvidia's global operations head, exploring collaboration despite U.S. chip restrictions. China promised foreign enterprise support, while Nvidia reaffirmed its ...

The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...